Microstructure formation in Sn-Cu-Ni solder alloys

Void formation at the interface in Sn/Cu solder joints

The effect of electroplated Cu (EPC), electroplated Sn (EPS) and Cu addition (0.7 wt.%) on the void formation at the reaction interfacewas investigated through the reaction of solderswithCu substrates. The voidswere observed at the Cu3Sn/EPC interface in the Sn/EPC joints after aging at 150 C, while not at the Cu3Sn/high purity Cu (HPC) interface in the Sn/HPC joints even after aging at 180 C f...

Interfacial Reactions Between Sn–58 mass%Bi Eutectic Solder and (Cu, Electroless Ni–P/Cu) Substrate

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 9 10 A/cm for 168.5 h at 150 C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a th...

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Nano-sized, nonreacting, noncoarsening ZrO2 particles reinforced Sn–3.0 wt%Ag–0.5 wt%Cu composite solders were prepared by mechanically dispersing ZrO2 nano-particles into Sn–Ag–Cu solder. The interfacial morphology of unreinforced Sn–Ag–Cu solder and solder joints containing ZrO2 nano-particles with Au/Ni metallized Cu pads on ball grid array (BGA) substrates and the distribution of reinforcin...

(100) surface segregation in Cu-Ni alloys.